CINTERION Introduces the World’s Smallest Solderable M2M Module

CINTERION today introduced BGS2, the world’s smallest LGA (Land Grid Array) module for M2M solutions requiring voice and high speed GPRS data.

Designed for high volume production, this ultra compact module is ideal for small M2M devices like personal tracking units and portable medical devices that help safeguard health and wellness.

CINTERION had already pioneered and introduced the highly efficient and reliable LGA surface mounting technology, bringing the fully automated production for the state-of-the-art technology to meet even the most demanding M2M applications. Now, BGS2 represents the latest technology trends being developed to simplify the direct link of Near Field Communication (NFC) devices, sensors or GPS receivers to the micro controller of the host application, helping to lower the total cost of ownership for implementers. Like all CINTERION modules, BGS2 meets the most stringent industry standards and comes with full type approval (FTA) as well as pre-certification by the world’s largest carriers to support global functionality and a swift time-to-market.

BGS2 is the slimmest surface mount M2M module in the world,” said Norbert Muhrer, CINTERION Executive Vice President at Gemalto.

We’ve been able to pack the same unparalleled reliability from decades of M2M expertise into this highly compact form factor. Based on extensive market and customer feedback, we’ve streamlined the most compelling features and provided options for dual or quad-band to help make it one of the most flexible and economical modules on the market.

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