Telit Cinterion introduces the FE990B34/40 LGA family of 5G modules featuring the Snapdragon X72 chipset, ...
Category: IoT Solutions & Innovations
Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset
Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset
Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity
Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity
World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2
World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2
Semtech Announces the Launch of the AirLink® XR60, the World’s Smallest Rugged 5G Router
Semtech Announces the Launch of the AirLink® XR60, the World’s Smallest Rugged 5G Router
VeriSilicon and Innobase Jointly Launch a 5G RedCap/4G LTE Dual-Mode Modem Solution
VeriSilicon and Innobase Jointly Launch a 5G RedCap/4G LTE Dual-Mode Modem Solution
Holtek Enables Sigfox 0G technology on its BC68F2150 Chipset
Holtek Enables Sigfox 0G technology on its BC68F2150 Chipset
Wireless Broadband Alliance Announces Wi-Fi HaLow Entering Real-World Commercial IoT Deployments Across a Range of Sectors
Wireless Broadband Alliance Announces Wi-Fi HaLow Entering Real-World Commercial IoT Deployments Across a Range of Sectors
Morse Micro Demonstrates World’s Longest Range Wi-Fi HaLow Solution, Reaching 3 Kilometers
Morse Micro Demonstrates World’s Longest Range Wi-Fi HaLow Solution, Reaching 3 Kilometers
Quectel unveils Wi-Fi 7 modules for next-generation connectivity
Quectel unveils Wi-Fi 7 modules for next-generation connectivity