DE910-DUAL Brings 3G CDMA Connectivity and GPS Capability in a new LGA Form Factor Family
Telit Wireless Solutions, Inc., the U.S.-based mobile technology arm of Telit Communications (AIM: TCM), announced today the debut of the DE910-DUAL module, allowing M2M developers to leverage the strength of 3G CDMA networks for applications such as consumer electronics, mobile health devices, as well as telematics and mobile computing.
Featuring the same Land Grid Array (LGA) form factor as its globally compatible UMTS/HSPA counterpart, the HE910, the DE910-DUAL module will offer Telit customers the flexibility to connect to two of the most prevalent networks worldwide and experience true global coverage with one core application design. Telit will support this new LGA form factor by further introducing modules into the family format, providing the same logical interfacing and full hardware compatibility among all existing and future members of the family.
“Using Telit’s DE910-DUAL module to connect to CDMA networks provides M2M developers not only the universal coverage required by tracking devices, but also the data transfer speed to support feature-rich in-car telematics and medical device applications that are quickly becoming the market standard,” said Mike Ueland, vice president and general manager of Telit Wireless Solutions North America.
Along with built-in gpsOne® assisted GPS and autonomous GPS, the DE910-DUAL features an ultra-compact LGA package measuring 28.2 x 28.2 x 2.6mm and an extended operating temperature range of -30°C to +85°C, making it the perfect platform for mobile computing and aftermarket telematics devices.
A dual-band CDMA 1x EV-DO Rev. A module, the DE910-DUAL protects investments by offering complete backward compatibility to 1xRTT and EV-DO Rev. 0, effectively extending the life of an application. As with all Telit modules, the DE910-DUAL is equipped with Over-the-Air firmware updates by means of Premium FOTA Management, enabling remote upgrades of the module software.
Additional features such as integrated TCP/IP and UDP Stack, RX diversity for increased performance, and a three-channel ADC and one-channel DAC provide extended functionality, adding value to the end application without adding cost.