Huawei Launches the World’s First Module Fully Compatible with NGFF Interface Specification

Huawei Launches the World's First Module Fully Compatible with NGFF Interface Specification

Huawei MU736, based on Intel’s HSPA+ Modem Solution, Unveiling now.

Huawei, a leading global information and communications technology (ICT) solutions provider, today unveiled the Huawei MU736, the world’s first WWAN module that is fully compliant with the Next Generation Form Factor (NGFF) standard.

The NGFF standard enables a transition from Mini-PCIe Cards to a smaller form factor module in size, volume, and system design flexibility. The MU736 NGFF module is based on Intel’s industry leading XMM™ 6260 HSPA+ modem solution, supporting penta-band operation (B1/B2/B4/B5/B8) for worldwide network coverage, low power consumption, Global Navigation Satellite System (GNSS), and major carrier certifications, enabling easier and more flexible design and integration into end devices. In addition, the MU736 supports all NGFF features to optimize performance, power consumption, and usability.

Huawei Launches the World's First Module Fully Compatible with NGFF Interface SpecificationIntel has optimized the performance, power consumption, and end user experience of the XMM™ 6260 HSPA+ modem when integrated with Intel-based Ultrabook™ and tablet platforms. The MU736 based on this chipset is an ideal choice for PC OEMs and ODMs to use in long battery life, thin form factor devices that require best in class cellular platform KPIs (e.g. performance, size, current consumption). MU736 sample is ready now, and will be Mass-Production in early of 2013.

Horst Pratsch, head of product line modules and M2M at Intel Corporation was quoted:
Intel is pleased to be working with Huawei to bring to market the world’s first 3G NGFF module offering worldwide coverage, high performance, and an optimized user experience. Huawei’s MU736 3G NGFF module takes advantage of Intel’s experience in ramping HSPA+ globally in industry leading smartphone devices, along with integration, validation, and optimization in Intel computing platforms.

Holy He, Head of Huawei M2M solution said:

“It is a great opportunity to cooperate with Intel on NGFF module to boom the Ultrabook™ market, we believe that MU736 would help PC vendors to expand the worldwide market with global network supporting, certification and carrier TA.”

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