Intel’s XMM™ 6255 HSPA platform is the engine inside u-blox’ low-cost 3G-only module.
Swiss-based u-blox, a leading provider of wireless and positioning semiconductors, software and solutions, announced that the company is collaborating with Intel Corporation to bring a small, cost-effective 3G-only HSPA module to the market.
Based on Intel’s XMM™ 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with u-blox’ SARA 2G and LISA 3G module series. u-blox’ 2G-3G-4G nested design philosophy allows product designers to offer tailored solutions to their target markets based on a single PCB design. This facilitates product diversity and easy migration while keeping price at a minimum through reduced design, test, logistics and certification costs.
“As operators start to sunset their GSM/GPRS services, we have partnered with Intel to bring the cost of 3G connectivity down,” said Nikolaos Papadopoulos, President of u-blox America.
“For 3G-only M2M devices, our compact HSPA-only module, which is about the size of a quarter, is layout compatible with our popular SARA GSM/GPRS wireless module series. This is the perfect combination for the North American market.”
The modem supports full HSPA connectivity and low power consumption in an ultra-small form factor.
“Integrating the 3G power amplifier in the transceiver delivers the smallest possible size and lowest number of components enabling new applications of 3G in machine-to-machine applications. Intel is pleased to work with u-blox in bringing this solution to the market.”
Based on Intel® X-GOLD™ 625 digital- and analog- baseband with integrated Power Management Unit and the Intel® SMARTi™ UE2p transceiver for 3G, the Intel® XMM™ 6255 platform is the smallest available HSPA modem chipset. Its compact size and powerful HSPA performance enables u-blox to create the world’s smallest dedicated 3G modem module dedicated to operation over 3G networks worldwide.