Reduces cost and speeds time to market for designs based on Freescale’s i.MX 6 series applications processors.
Digi International today announced ConnectCore® 6, the world’s first surface mount multi-chip module with built-in wireless connectivity. The ConnectCore 6 provides access to all of the features of the Freescale® i.MX 6 Quad, i.MX 6 Dual and i.MX 6 Solo processors, making it the ideal solution for M2M applications. The module’s small form factor and design, which requires no connectors, reduces manufacturing costs and makes it easier than ever to add wireless capabilities to portable devices. The product was created to reduce design risk, complexity and time to market for those developing products for transportation, security and other industrial applications.
The ConnectCore 6 module’s built-in ability to connect via Wi-Fi, Bluetooth, Bluetooth Low Energy and Device Cloud by Etherios can save product designers hundreds of hours of time and expense in designing wireless devices—including the pain of passing and maintaining global certifications. Complete software development tools are provided to build application software to help get products to market faster. The module has a 5-year warranty and is designed for long-term availability, ensuring that it will be available for the lifecycle of developed products.
Digi has a longstanding track record in delivering embedded core modules based on Freescale i.MX processors. Other offerings include ConnectCore® modules based on the i.MX53 and i.MX51 processor families, and the ConnectCard module based on the i.MX28 processor. Scalable and energy-efficient, the ConnectCore family is ideal for a variety of applications. For example, the ConnectCore based on the i.MX53 processor is used to control and stream video wirelessly from the Robonaut, a humanoid robot created by NASA to assist astronauts on the International Space Station.
“Digi International, a Freescale Connect proven partner has more than 6 years of collaboration with system-on-module solutions based on Freescale technology,” said Stéphane Gervais-Ducouret, Embedded Board Solutions partnership lead at Freescale.
“Digi International’s innovative ConnectCore 6 form factor can fully leverage the unique scalability, performance, reliability and longevity of i.MX 6 series processors.”
Joel Young, CTO and senior vice president of research and development, Digi International, said:
“The ConnectCore 6 has one of the smallest form factors on the market and it requires no connectors for assembly. The unique design, paired with pre-certified, integrated and secure wireless connectivity on the module, low power consumption and heat dissipation capabilities, make it the clear solution for M2M products.”
“The module offers innovation for portable M2M devices in many industries, and the module will be available for the lifecycles of the products.”
ConnectCore 6 kits and prototyping modules will be available in March 2014. A fully integrated single-board computer will be available in Summer 2014. For more information about ConnectCore 6 modules, visit www.digi.com/connectcore6.