HUAWEI franchise expands 3G and 4G cellular M2M communications portfolio at SILICA

SILICA, an Avnet, Inc. company, has announced a franchise agreement with Huawei, the worldwide leading global vendor of cellular wireless infrastructure and modules.

Under the agreement, SILICA is marketing multi-standard 3G and 4G wireless modules in a choice of popular form factors, including LGA, PCIe and PCI-SIG M.2. Based on HUAWEI HiSilicon chipset technology, the new modules offer features specific for M2M communication. As a leading distributor, SILICA provides in-depth technical support and is providing software support out of the box for HUAWEI modules for their ArchiTech evaluation boards, accelerating and facilitating the product development. The boards also feature mini PCIe connectors and SIM cardholders.

M2M communications and wider Internet of Things (IoT) applications demand low power, high reliability wireless links. Where cellular radio networks are employed, certified products that support multiple standards and operators are preferred, allowing for networks updates and minimizing inventory if the same products are to be used in more than one country. HUAWEI modules support over 90% of operators worldwide.

Even though lower data rates may be adequate for many of today’s M2M applications, 3G (HSPA/HSPA+) is now becoming the dominant standard and 4G (LTE/LTE-A) networks are being rolled out rapidly. As a result, designers need to specify 3G or dual-standard 3G/4G modules to ensure that products have a long operating life.

Georg Steimel, head of M2M Solutions, HUAWEI, said:
“We are very glad to have found an experienced franchise partner with SILICA that will enable us to significantly leverage the marketing of our products. Its outstanding expertise in the industry and in-depth support make SILICA an ideal partner. The partnership with the agile and market leading player will accelerate our growth significantly and in combination with our innovative technology will help to gain the leadership in this market.”

Mario Orlandi, president SILICA, commented:
“The SILICA team is fully engaged around the many opportunities that come when working with the world’s leading cellular communications company. The rate of innovation at Huawei is exceptional and will ensure that we’re able to provide our customers with leading-edge products in terms of performance, cost-effectiveness and reliability.”

“M2M and the general IoT market is the fastest growing sector of the electronics industry and Huawei products make it easier than ever for customers to connect their products to the cloud.”