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SIMCom Wireless Solutions Selects Sequans for Suite of LTE for IoT Modules

SIMCom Wireless Solutions Selects Sequans for  Suite of LTE for IoT Modules

LTE for IoT chipmaker Sequans Communications S.A. announced that SIMCom Wireless, global leading machine-to-machine (M2M) wireless modules and solutions supplier, has adopted Sequans’ LTE chip technology for a suite of M2M and IoT modules.

SIMCom will use Sequans’ LTE Cat 1 Platform, Calliope, and its newest LTE Cat M1/NB1 platform, Monarch, for a suite of module solutions. The first module to be introduced by SIMCom under the agreement is an LTE Cat 1 module, SIM7700V, based on Sequans’ Calliope LTE Cat 1 platform. It supports Verizon’s LTE bands 4 and 13 and supports VoLTE.

“We selected Sequans because they are a leader in LTE for IoT and because their chips have been proven in the field with operators around the world,” said Wendy Wang, General Manager, SIMCom.

“SIM7700V, our first Sequans-powered module, based on Sequans’ Calliope platform is available now. We believe that the new model will increase our market share in the North American market.”

Sequans’ Calliope LTE Cat 1 platform, compliant with Release 10/11 of the LTE standard, is for higher throughput IoT applications such as connected car and retail applications or applications requiring VoLTE capability. Calliope is certified by Verizon Wireless, AT&T, NTT DoCoMo, and T-Mobile US. Sequans’ Monarch LTE Cat M1/NB1 platform, compliant with Release 13 of the LTE standard, is for new narrowband applications such as wearables, asset trackers, and industrial sensors.

“SIMCom has an excellent reputation as an IoT and M2M solutions provider around the world and they have truly global market reach,” said Craig Miller, VP of worldwide marketing for Sequans. “SIMCom products have been deployed worldwide and certified by more than 100 agencies and operators, and we are pleased to provide our LTE chip technology to SIMCom.”

The SIM7700V LTE Cat 1 module supports LTE bands 4 and 13, is approximately 21 x 20 x 1.5mm in size, and is provided in a surface-mount LGA footprint.

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