Category: IoT Solutions & Innovations

Telit Cinterion Launches New Modules for Affordable, Low-Power LTE Cat. 1 bis and Multi-Constellation GNSS
Posted by IoT.Business.News
|Date: March 10, 2025
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Telit Cinterion Launches New Modules for Affordable, Low-Power LTE Cat. 1 bis and Multi-Constellation GNSS
Telit Cinterion has launched the LE310 LTE Cat. 1 bis and SL871K2 GNSS modules, designed for compact, low ...
Telit Cinterion has launched the LE310 LTE Cat. 1 bis and SL871K2 GNSS modules, designed for compact, low-power IoT applications requiring cellular connectivity and multi-constellation satellite locat ...
March 10, 2025
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Quectel Unveils LG580P GNSS, RTK, Multi-Constellation, Multi-Band Module for High-Precision Navigation Applications
Posted by IoT.Business.News
|Date: March 10, 2025
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Quectel Unveils LG580P GNSS, RTK, Multi-Constellation, Multi-Band Module for High-Precision Navigation Applications
Quectel introduces the LG580P, a compact GNSS module supporting multiple bands and constellations with RT ...
Quectel introduces the LG580P, a compact GNSS module supporting multiple bands and constellations with RTK and anti-jamming features, designed for precise navigation in robotics, agriculture, and auto ...
March 10, 2025
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IDEMIA Secure Transactions unveils fully scalable iSIM solution dedicated to the booming IoT market powered by Qualcomm modems
Posted by IoT.Business.News
|Date: March 06, 2025
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IDEMIA Secure Transactions unveils fully scalable iSIM solution dedicated to the booming IoT market powered by Qualcomm modems
IDEMIA Secure Transactions and Qualcomm collaborate to launch a fully scalable iSIM solution for the IoT ...
IDEMIA Secure Transactions and Qualcomm collaborate to launch a fully scalable iSIM solution for the IoT market, featuring Qualcomm's E41 4G Modem-RF to improve security, efficiency, and manufacturing ...
March 06, 2025
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G+D and AWS strengthen their collaboration to the next level by reimagining cloud-based eSIM offerings
Posted by IoT.Business.News
|Date: March 04, 2025
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G+D and AWS strengthen their collaboration to the next level by reimagining cloud-based eSIM offerings
Giesecke+Devrient (G+D) collaborates with AWS to advance cloud-based eSIM technology, enabling scalable d ...
Giesecke+Devrient (G+D) collaborates with AWS to advance cloud-based eSIM technology, enabling scalable deployments and new business models to support growing eSIM adoption in consumer and IoT markets ...
March 04, 2025
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Telit Cinterion Launches AI-Powered 5G Modules and Data Cards with Qualcomm’s Cutting-Edge Modem
Posted by IoT.Business.News
|Date: March 04, 2025
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Telit Cinterion Launches AI-Powered 5G Modules and Data Cards with Qualcomm’s Cutting-Edge Modem
Telit Cinterion introduces the FE990D and FN990D AI-powered 5G modules and data cards with Qualcomm X85/8 ...
Telit Cinterion introduces the FE990D and FN990D AI-powered 5G modules and data cards with Qualcomm X85/82 Modem-RF, supporting NB-IoT NTN and 3GPP Release 18 for enhanced industrial and enterprise Io ...
March 04, 2025
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Semtech Strengthens 5G Leadership with Expanded Module Portfolio
Posted by IoT.Business.News
|Date: March 04, 2025
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Semtech Strengthens 5G Leadership with Expanded Module Portfolio
Semtech unveiled two new 5G broadband modules, EM9492 and EM9295, powered by Qualcomm platforms to delive ...
Semtech unveiled two new 5G broadband modules, EM9492 and EM9295, powered by Qualcomm platforms to deliver advanced and cost-effective 5G connectivity solutions for routers, gateways, and IoT applicat ...
March 04, 2025
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Quectel Unveils Its New Smart Module SC200V at MWC 2025, Unlocking New Possibilities for High-Performance and Advanced Multi-Media Smart Devices
Posted by IoT.Business.News
|Date: March 03, 2025
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Quectel Unveils Its New Smart Module SC200V at MWC 2025, Unlocking New Possibilities for High-Performance and Advanced Multi-Media Smart Devices
Quectel introduces the SC200V smart module featuring Qualcomm’s processor, Android support, and enhanced ...
Quectel introduces the SC200V smart module featuring Qualcomm’s processor, Android support, and enhanced multimedia capabilities, ideal for industrial and smart devices requiring high-speed connectivi ...
March 03, 2025
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Sequans Unveils Next Generation Cellular IoT Semiconductors at Mobile World Congress 2025
Posted by IoT.Business.News
|Date: March 03, 2025
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Sequans Unveils Next Generation Cellular IoT Semiconductors at Mobile World Congress 2025
Sequans Communications introduces third-generation low-power cellular IoT semiconductors with 5G eRedCap ...
Sequans Communications introduces third-generation low-power cellular IoT semiconductors with 5G eRedCap support, enhancing longevity, power efficiency, and cost-effectiveness for a wide range of IoT ...
March 03, 2025
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Globalstar Announces Two-Way Satellite IoT Solution
Posted by IoT.Business.News
|Date: February 26, 2025
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Globalstar Announces Two-Way Satellite IoT Solution
Globalstar introduces the RM200M, a two-way satellite IoT module with integrated GNSS, Bluetooth, and acc ...
Globalstar introduces the RM200M, a two-way satellite IoT module with integrated GNSS, Bluetooth, and accelerometer, enabling global connectivity and edge computing for fleet tracking, asset monitorin ...
February 26, 2025
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Silicon Labs Redefines Smart Home Connectivity with New Concurrent Multiprotocol SoC
Posted by IoT.Business.News
|Date: February 26, 2025
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Silicon Labs Redefines Smart Home Connectivity with New Concurrent Multiprotocol SoC
Silicon Labs introduces the MG26 SoC, offering high-performance multiprotocol wireless connectivity, AI/M ...
Silicon Labs introduces the MG26 SoC, offering high-performance multiprotocol wireless connectivity, AI/ML acceleration, and top security features for smart home applications compatible with Matter an ...
February 26, 2025
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IoT Platforms: Key Capabilities, Vendor Landscape and Selection Criteria

AIoT: From Connected Data to Intelligent Automation Across Industries

Digital Twins in IoT: From Real-Time Data to Simulation and Optimization

Edge Computing for IoT: Architecture, Use Cases, Benefits and Deployment Strategies

IoT Security: Threats, Best Practices and Secure-by-Design Strategies

Category: IoT Solutions & Innovations

Telit Cinterion Launches New Modules for Affordable, Low-Power LTE Cat. 1 bis and Multi-Constellation GNSS

Telit Cinterion Launches New Modules for Affordable, Low-Power LTE Cat. 1 bis and Multi-Constellation GNSS

Quectel Unveils LG580P GNSS, RTK, Multi-Constellation, Multi-Band Module for High-Precision Navigation Applications

Quectel Unveils LG580P GNSS, RTK, Multi-Constellation, Multi-Band Module for High-Precision Navigation Applications

IDEMIA Secure Transactions unveils fully scalable iSIM solution dedicated to the booming IoT market powered by Qualcomm modems

IDEMIA Secure Transactions unveils fully scalable iSIM solution dedicated to the booming IoT market powered by Qualcomm modems

G+D and AWS strengthen their collaboration to the next level by reimagining cloud-based eSIM offerings

G+D and AWS strengthen their collaboration to the next level by reimagining cloud-based eSIM offerings

Telit Cinterion Launches AI-Powered 5G Modules and Data Cards with Qualcomm’s Cutting-Edge Modem

Telit Cinterion Launches AI-Powered 5G Modules and Data Cards with Qualcomm’s Cutting-Edge Modem

Semtech Strengthens 5G Leadership with Expanded Module Portfolio

Semtech Strengthens 5G Leadership with Expanded Module Portfolio

Quectel Unveils Its New Smart Module SC200V at MWC 2025, Unlocking New Possibilities for High-Performance and Advanced Multi-Media Smart Devices

Quectel Unveils Its New Smart Module SC200V at MWC 2025, Unlocking New Possibilities for High-Performance and Advanced Multi-Media Smart Devices

Sequans Unveils Next Generation Cellular IoT Semiconductors at Mobile World Congress 2025

Sequans Unveils Next Generation Cellular IoT Semiconductors at Mobile World Congress 2025

Globalstar Announces Two-Way Satellite IoT Solution

Globalstar Announces Two-Way Satellite IoT Solution

Silicon Labs Redefines Smart Home Connectivity with New Concurrent Multiprotocol SoC

Silicon Labs Redefines Smart Home Connectivity with New Concurrent Multiprotocol SoC