America’s third largest mobile operator approves u-blox’ compact CDMA 1xRTT modems for M2M applications.
u‑blox, the Swiss global leader in positioning and wireless semiconductors, has successfully tested its surface-mount LISA-C200 dual-band CDMA 1xRTT modem module for compatibility on Sprint’s wireless network. This allows customers who design LISA-C200 into their M2M devices to get fast approval of their products to operate over Sprint’s nationwide CDMA mobile network in the U.S.
Main applications include mobile Internet terminals, car infotainment and telematics, Automatic Meter Reading (AMR), Remote Monitoring Automation and Control (RMAC), surveillance and security, road pricing, asset tracking, fleet management, anti-theft systems, and Point of Sales (PoS) terminals.
In addition, the u-blox FW75-C200 1xRTT module also was tested for compatibility. This connectorized module offers all the features of the LISA-C200, and is drop-in compatible with the industry standard GSM module MC75i. This allows transition from GSM technology to Sprint’s CDMA network without any hardware changes to existing designs.
Nikolaos Papadopoulos, President, u‑blox America, said:
“After a record development time and a comprehensive testing procedure, we are proud that our LISA-C200 wireless module was approved for use over Sprint’s CDMA network in the U.S. Excellent work by our wireless CDMA R&D center in San Diego and support from Sprint’s test engineers facilitated a fast and smooth certification process.”
“Sprint is proud to apply our extensive open network experience to the deployment of the LISA-C200 wireless module from u-blox. Our combined technologies introduce a flexible and easy-to-use capability that is simple for developers to integrate it into new devices to meet needs across many segments,” said Wayne Ward, Vice President-Emerging Solutions, Sprint.
LISA-C200 is the world’s smallest wireless CDMA2000 module delivering data-rates of 153 kb/s (up and downlink) with voice and data capabilities. LISA modules come in SMT form-factor and have a very small footprint (only 22.4 x 33.2 x 2.7 mm), allowing easy mounting on any application board. The module is also pin/pad compatible with u-blox’ LEON GSM and LISA HSPA modules.
Features include over-the-air carrier provisioning and operating temperature -30 to +85 deg. C.
Swiss-based u-blox (SIX:UBXN) is the global leader in positioning and wireless semiconductors for the consumer, industrial and automotive markets. Our solutions enable people, vehicles and machines to locate their exact position and wirelessly communicate via voice, text or video. With a broad portfolio of chips, modules and software solutions, u-blox is uniquely positioned to enable OEMs to develop innovative personal, professional and M2M solutions quickly and cost-effectively. With headquarters in Thalwil, Switzerland, u-blox is globally present with offices in Europe, Asia and the USA.