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Sequans Extends Collaboration with TSMC to Develop World’s first LTE-M chip for IoT

Sequans Extends Collaboration with TSMC to Develop World’s first LTE-M chip for IoT

LTE chipmaker Sequans Communications S.A. has leveraged its long-term partnership with TSMC, and TSMC’s ultra-low-power technology, to create Monarch, the world’s first commercially available and most highly optimized LTE-M chip for the Internet of Things (IoT).

Georges Karam, Sequans’ CEO, said:

“TSMC’s process technology, design IP, development tools, and manufacturing support have been instrumental in our success in the 4G chip business for more than a decade, and never more so than in the IoT market with our Monarch LTE-M chip.”

“We’ve launched more than a dozen 4G chips in that time, each of them produced by TSMC. Our success is due in no small part to our strategic relationship with TSMC.”

“TSMC congratulates Sequans on the successful launch of Monarch, a game-changing solution for wide area, low-power IoT market,” said Simon Wang, senior director of TSMC’s IoT Business Division. “We believe IoT will be a major growth driver for the semiconductor industry in years to come, and we’re excited about our long-term strategic relationship with an industry leader such as Sequans.”

“TSMC’s ultra-low-power (ULP) technology allows even 4G LTE chips to meet the long battery-life needs of many IoT use cases,” Karam added. “Their excellent portfolio of IP cores and electronic design automation (EDA) tools enable fast and economical chip development. And they have been an outstanding supply partner, reliably supporting Sequans’ volume needs to ensure our customers get to market on time.”

Monarch has already been designed into numerous LTE for IoT devices, including devices recently announced by Gemalto, NimbeLink, Link Labs, Encore Networks, and PyCom.

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