Category: IoT Solutions & Innovations

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System
Posted by IoT.Business.News
|Date: March 05, 2023
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Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System
Fibocom unveiled the Fx190/Fx180 series 5G modules based on Snapdragon X75 and X72 at MWC Barcelona 2023, ...
Fibocom unveiled the Fx190/Fx180 series 5G modules based on Snapdragon X75 and X72 at MWC Barcelona 2023, delivering improved 5G performance, AI-enhanced architecture, and support for Sub-6GHz and mmW ...
March 05, 2023
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Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software
Posted by IoT.Business.News
|Date: March 01, 2023
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Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software
Renesas introduces Quick-Connect Studio, a cloud-based platform that allows engineers to simultaneously d ...
Renesas introduces Quick-Connect Studio, a cloud-based platform that allows engineers to simultaneously develop hardware and software, accelerating IoT prototype validation and simplifying production- ...
March 01, 2023
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Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany
Posted by IoT.Business.News
|Date: February 28, 2023
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Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany
Cavli Wireless will showcase its new C16QS LTE CAT1.bis module at Embedded World 2023 in Germany, featuri ...
Cavli Wireless will showcase its new C16QS LTE CAT1.bis module at Embedded World 2023 in Germany, featuring integrated eSIM and GNSS for cost-effective, global IoT connectivity in logistics, automotiv ...
February 28, 2023
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Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys
Posted by IoT.Business.News
|Date: February 28, 2023
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Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys
Quectel introduces the AU30Q UWB automotive module featuring precise localization, enhanced security, and ...
Quectel introduces the AU30Q UWB automotive module featuring precise localization, enhanced security, and compatibility with CCC and ICCE standards to support next-gen digital car key and smart vehicl ...
February 28, 2023
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Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals
Posted by IoT.Business.News
|Date: February 27, 2023
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Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals
Quectel introduces the Rx255C series of 5G RedCap modules featuring Qualcomm's Snapdragon X35 chipset, op ...
Quectel introduces the Rx255C series of 5G RedCap modules featuring Qualcomm's Snapdragon X35 chipset, optimized for low power and cost to expand 5G connectivity across diverse IoT verticals and appli ...
February 27, 2023
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Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets
Posted by IoT.Business.News
|Date: February 27, 2023
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Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets
Quectel introduces the RG650E and RG650V 5G modules based on 3GPP Release 17, featuring Snapdragon X75/X7 ...
Quectel introduces the RG650E and RG650V 5G modules based on 3GPP Release 17, featuring Snapdragon X75/X72 modems to boost performance in fixed wireless access, enhanced mobile broadband, and industri ...
February 27, 2023
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Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US
Posted by IoT.Business.News
|Date: February 27, 2023
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Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US
Deutsche Telekom and T-Mobile US introduced T-DevEdge, a joint developer platform with network APIs to si ...
Deutsche Telekom and T-Mobile US introduced T-DevEdge, a joint developer platform with network APIs to simplify access to connectivity services, enabling innovations like Siemens Energy’s remote maint ...
February 27, 2023
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Hologram Announces its Next-Generation Hyper SIM
Posted by IoT.Business.News
|Date: February 25, 2023
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Hologram Announces its Next-Generation Hyper SIM
Hologram introduces the next-generation Hyper SIM featuring native integrations with US and Canadian carr ...
Hologram introduces the next-generation Hyper SIM featuring native integrations with US and Canadian carriers and network fallback for uninterrupted global IoT connectivity and enhanced performance in ...
February 25, 2023
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Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT
Posted by IoT.Business.News
|Date: February 22, 2023
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Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT
Sequans and Eseye introduce the first multi-carrier iSIM solution for IoT, combining embedded eSIM techno ...
Sequans and Eseye introduce the first multi-carrier iSIM solution for IoT, combining embedded eSIM technology and global connectivity to enable seamless carrier switching and reduce deployment complex ...
February 22, 2023
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Sierra Wireless Announces New 5G LPWA HL7900 Module Integrating Sony’s Altair ALT1350 Chipset
Posted by IoT.Business.News
|Date: February 21, 2023
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Sierra Wireless Announces New 5G LPWA HL7900 Module Integrating Sony’s Altair ALT1350 Chipset
Sierra Wireless introduces the 5G HL7900 LPWA module powered by Sony’s ALT1350 chipset, delivering ultra- ...
Sierra Wireless introduces the 5G HL7900 LPWA module powered by Sony’s ALT1350 chipset, delivering ultra-low power consumption, hybrid connectivity, and enhanced security for next-generation IoT appli ...
February 21, 2023
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IoT Platforms: Key Capabilities, Vendor Landscape and Selection Criteria

AIoT: From Connected Data to Intelligent Automation Across Industries

Digital Twins in IoT: From Real-Time Data to Simulation and Optimization

Edge Computing for IoT: Architecture, Use Cases, Benefits and Deployment Strategies

IoT Security: Threats, Best Practices and Secure-by-Design Strategies

Category: IoT Solutions & Innovations

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System

Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software

Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software

Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany

Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany

Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys

Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys

Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals

Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals

Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets

Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets

Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US

Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US

Hologram Announces its Next-Generation Hyper SIM

Hologram Announces its Next-Generation Hyper SIM

Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT

Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT

Sierra Wireless Announces New 5G LPWA HL7900 Module Integrating Sony’s Altair ALT1350 Chipset

Sierra Wireless Announces New 5G LPWA HL7900 Module Integrating Sony’s Altair ALT1350 Chipset