Category: IoT Solutions & Innovations

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Fibocom Collaborates with MediaTek to Pioneer the FWA Market with “Fast-to-deploy” 5G Solution Based on FG370 Module

Posted by IoT.Business.News
|Date: March 05, 2023
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Fibocom Collaborates with MediaTek to Pioneer the FWA Market with “Fast-to-deploy” 5G Solution Based on FG370 Module

Fibocom and MediaTek introduce the FG370-based 5G FWA solution, offering fast deployment, advanced Wi-Fi ...

Fibocom and MediaTek introduce the FG370-based 5G FWA solution, offering fast deployment, advanced Wi-Fi 7 support, and high-speed connectivity to accelerate 5G adoption in fixed wireless access devic ...

March 05, 2023
| by IoT.Business.News

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Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System

Posted by IoT.Business.News
|Date: March 05, 2023
| 0 comments

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System

Fibocom unveiled the Fx190/Fx180 series 5G modules based on Snapdragon X75 and X72 at MWC Barcelona 2023, ...

Fibocom unveiled the Fx190/Fx180 series 5G modules based on Snapdragon X75 and X72 at MWC Barcelona 2023, delivering improved 5G performance, AI-enhanced architecture, and support for Sub-6GHz and mmW ...

March 05, 2023
| by IoT.Business.News

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Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software

Posted by IoT.Business.News
|Date: March 01, 2023
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Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software

Renesas introduces Quick-Connect Studio, a cloud-based platform that allows engineers to simultaneously d ...

Renesas introduces Quick-Connect Studio, a cloud-based platform that allows engineers to simultaneously develop hardware and software, accelerating IoT prototype validation and simplifying production- ...

March 01, 2023
| by IoT.Business.News

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Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany

Posted by IoT.Business.News
|Date: February 28, 2023
| 0 comments

Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany

Cavli Wireless will showcase its new C16QS LTE CAT1.bis module at Embedded World 2023 in Germany, featuri ...

Cavli Wireless will showcase its new C16QS LTE CAT1.bis module at Embedded World 2023 in Germany, featuring integrated eSIM and GNSS for cost-effective, global IoT connectivity in logistics, automotiv ...

February 28, 2023
| by IoT.Business.News

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Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys

Posted by IoT.Business.News
|Date: February 28, 2023
| 0 comments

Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys

Quectel introduces the AU30Q UWB automotive module featuring precise localization, enhanced security, and ...

Quectel introduces the AU30Q UWB automotive module featuring precise localization, enhanced security, and compatibility with CCC and ICCE standards to support next-gen digital car key and smart vehicl ...

February 28, 2023
| by IoT.Business.News

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Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals

Posted by IoT.Business.News
|Date: February 27, 2023
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Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals

Quectel introduces the Rx255C series of 5G RedCap modules featuring Qualcomm's Snapdragon X35 chipset, op ...

Quectel introduces the Rx255C series of 5G RedCap modules featuring Qualcomm's Snapdragon X35 chipset, optimized for low power and cost to expand 5G connectivity across diverse IoT verticals and appli ...

February 27, 2023
| by IoT.Business.News

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Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets

Posted by IoT.Business.News
|Date: February 27, 2023
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Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets

Quectel introduces the RG650E and RG650V 5G modules based on 3GPP Release 17, featuring Snapdragon X75/X7 ...

Quectel introduces the RG650E and RG650V 5G modules based on 3GPP Release 17, featuring Snapdragon X75/X72 modems to boost performance in fixed wireless access, enhanced mobile broadband, and industri ...

February 27, 2023
| by IoT.Business.News

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Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US

Posted by IoT.Business.News
|Date: February 27, 2023
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Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US

Deutsche Telekom and T-Mobile US introduced T-DevEdge, a joint developer platform with network APIs to si ...

Deutsche Telekom and T-Mobile US introduced T-DevEdge, a joint developer platform with network APIs to simplify access to connectivity services, enabling innovations like Siemens Energy’s remote maint ...

February 27, 2023
| by IoT.Business.News

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Hologram Announces its Next-Generation Hyper SIM

Posted by IoT.Business.News
|Date: February 25, 2023
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Hologram Announces its Next-Generation Hyper SIM

Hologram introduces the next-generation Hyper SIM featuring native integrations with US and Canadian carr ...

Hologram introduces the next-generation Hyper SIM featuring native integrations with US and Canadian carriers and network fallback for uninterrupted global IoT connectivity and enhanced performance in ...

February 25, 2023
| by IoT.Business.News

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Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT

Posted by IoT.Business.News
|Date: February 22, 2023
| 0 comments

Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT

Sequans and Eseye introduce the first multi-carrier iSIM solution for IoT, combining embedded eSIM techno ...

Sequans and Eseye introduce the first multi-carrier iSIM solution for IoT, combining embedded eSIM technology and global connectivity to enable seamless carrier switching and reduce deployment complex ...

February 22, 2023
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Fibocom Launches Global LTE Cat.1 bis Module LE271-GL

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1NCE Expands IoT Software, AI and Services Offering

Category: IoT Solutions & Innovations

Fibocom Collaborates with MediaTek to Pioneer the FWA Market with “Fast-to-deploy” 5G Solution Based on FG370 Module

Fibocom Collaborates with MediaTek to Pioneer the FWA Market with “Fast-to-deploy” 5G Solution Based on FG370 Module

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System

Fibocom to Launch the Leading-Edge 5G Sub-6GHz and mmWave Module Fx190/Fx180 Series Based on Snapdragon X75 and X72 5G Modem-RF System

Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software

Renesas Unveils Quick-Connect Studio: Industry’s First-Ever Cloud-based System Development Tool to Dynamically Create IoT Software

Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany

Cavli Wireless to Reveal the Ultra Low-Cost CAT1.bis Module C16QS at Embedded World 2023 Germany

Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys

Quectel Announces Ultra-wideband Automotive Grade Module, CCC and ICCE Compliant to Enable Newest Generation Digital Car Keys

Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals

Quectel Announces RedCap Rx255C Module Series to Help Expand the Reach of 5G into More IoT Applications and Verticals

Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets

Quectel Announces New Generation 5G Release 17 Module Series to Address Growing 5G FWA and eMBB Markets

Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US

Deutsche Telekom and T‑Mobile US introduce Network APIs and a Joint Developer Platform in Germany and the US

Hologram Announces its Next-Generation Hyper SIM

Hologram Announces its Next-Generation Hyper SIM

Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT

Sequans and Eseye Introduce the World’s First Multi-Carrier iSIM Solution for IoT