Quectel Wireless Solutions, the leading global supplier of Internet of Things (IoT) modules, announced that the company’s ultra-compact EG91-NA LTE Cat 1 and EG95-NA LTE Cat 4 modules have been certified by AT&T for operating on the carrier’s LTE wireless network.
This Type Approval will accelerate time-to-market for IoT integrators and providers in North America who are looking to deploy IoT/M2M solutions offering high and medium data rates as well as stable and reliable connectivity.
Based on Qualcomm’s MDM9x07 modem, the two certified modules support FDD LTE frequency bands of B2/B3/B5/B12/B13, and are 3G fallback on bands B2/B4/B5. This ensures that customers can deploy their IoT solutions with one single SKU on all networks throughout the whole North American region, including the mainstream carriers AT&T, Verizon, T-Mobile, Rogers and Bell.
Both EG91-NA and EG95-NA are offered in an ultra-compact LGA package measuring 25 x 29 x 2.3mm, making them ideal for size-constrained applications. In addition, the two products are pin-to-pin compatible with Quectel UMTS/HSPA+ UG95/UG96 and LTE Cat M1/Cat NB1/EGPRS BG96 modules, which allows developers to smoothly migrate from 3G to 4G, lower cost and cut development time.
Featuring cost-effective and low power LTE connectivity, EG91-NA delivers data rates of up to 10Mbit/s downlink and 5Mbit/s uplink, and is an ideal solution for a wide range of IoT verticals that are not reliant on high speed connectivity but still require the longevity and reliability of LTE networks, such as smart metering, wearable devices, asset tracking, fleet management, security and alarm systems.
EG95-NA adopts 3GPP Release 11 LTE technology, and offers 150Mbit/s downlink and 50Mbit/s uplink data rates. It can be applied in size sensitive applications such as trackers, handheld terminals, security and alarm systems.
Moreover, Quectel EG91-NA and EG95-NA have embedded power management unit featuring ultra-low deep-sleep current consumption in order to optimize the power consumption performance.
