Sequans Communications will present new 5G NR chips, LTE Cat 4 network modules, and upcoming 5G RedCap so ...
Category: IoT Solutions & Innovations
Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap
Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap
Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations
Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations
Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset
Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset
Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity
Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity
World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2
World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2
Semtech Announces the Launch of the AirLink® XR60, the World’s Smallest Rugged 5G Router
Semtech Announces the Launch of the AirLink® XR60, the World’s Smallest Rugged 5G Router
VeriSilicon and Innobase Jointly Launch a 5G RedCap/4G LTE Dual-Mode Modem Solution
VeriSilicon and Innobase Jointly Launch a 5G RedCap/4G LTE Dual-Mode Modem Solution
Holtek Enables Sigfox 0G technology on its BC68F2150 Chipset
Holtek Enables Sigfox 0G technology on its BC68F2150 Chipset
Wireless Broadband Alliance Announces Wi-Fi HaLow Entering Real-World Commercial IoT Deployments Across a Range of Sectors
Wireless Broadband Alliance Announces Wi-Fi HaLow Entering Real-World Commercial IoT Deployments Across a Range of Sectors