Category: IoT Solutions & Innovations

Quectel introduces new ultra-low latency Wi-Fi 7 modules for PC OEMs
Posted by IoT.Business.News
|Date: February 26, 2024
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Quectel introduces new ultra-low latency Wi-Fi 7 modules for PC OEMs
Quectel introduces new Wi-Fi 7 and Bluetooth 5.4 modules designed for PC OEMs, offering ultra-low latency ...
Quectel introduces new Wi-Fi 7 and Bluetooth 5.4 modules designed for PC OEMs, offering ultra-low latency, multi-link operation, and support for Intel, AMD, and Snapdragon platforms to improve wireles ...
February 26, 2024
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TCL launches the first 5G RedCap Dongle with Snapdragon® X35 5G Modem-RF System at MWC 2024
Posted by IoT.Business.News
|Date: February 26, 2024
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TCL launches the first 5G RedCap Dongle with Snapdragon® X35 5G Modem-RF System at MWC 2024
At MWC 2024, TCL launched the LINKKEY IK511, one of the first 3GPP R17 5G RedCap USB dongles powered by S ...
At MWC 2024, TCL launched the LINKKEY IK511, one of the first 3GPP R17 5G RedCap USB dongles powered by Snapdragon X35, aiming to accelerate 5G adoption for M2M and consumer applications. ...
February 26, 2024
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Fibocom Announces the Compatibility of Three Mainstream Operating Systems of its High-end 5G Smart Module SC171 at MWC Barcelona 2024
Posted by IoT.Business.News
|Date: February 26, 2024
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Fibocom Announces the Compatibility of Three Mainstream Operating Systems of its High-end 5G Smart Module SC171 at MWC Barcelona 2024
Fibocom announced that its high-end 5G smart module SC171 now supports Android, Linux, and Windows operat ...
Fibocom announced that its high-end 5G smart module SC171 now supports Android, Linux, and Windows operating systems, improving accessibility and expanding AIoT application possibilities showcased at ...
February 26, 2024
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Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules at MWC2024
Posted by IoT.Business.News
|Date: February 26, 2024
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Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules at MWC2024
Quectel introduces four new high-performance Wi-Fi and Bluetooth modules, including the FCU741R, FCS950R, ...
Quectel introduces four new high-performance Wi-Fi and Bluetooth modules, including the FCU741R, FCS950R, HCM010S, and HCM111Z, designed for diverse IoT applications with compact size, low power consu ...
February 26, 2024
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Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap
Posted by IoT.Business.News
|Date: February 23, 2024
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Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap
Sequans Communications will present new 5G NR chips, LTE Cat 4 network modules, and upcoming 5G RedCap so ...
Sequans Communications will present new 5G NR chips, LTE Cat 4 network modules, and upcoming 5G RedCap solutions for IoT applications at Mobile World Congress 2024 in Barcelona, highlighting advanced ...
February 23, 2024
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Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations
Posted by IoT.Business.News
|Date: February 22, 2024
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Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations
Quectel introduces the RG255G, a 5G RedCap module featuring MediaTek's UltraSave technology, offering low ...
Quectel introduces the RG255G, a 5G RedCap module featuring MediaTek's UltraSave technology, offering low power consumption and versatile form factors ideal for industrial automation, smart energy, we ...
February 22, 2024
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Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
Posted by IoT.Business.News
|Date: February 22, 2024
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Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024
Telit Cinterion introduces the FE990B34/40 LGA family of 5G modules featuring the Snapdragon X72 chipset, ...
Telit Cinterion introduces the FE990B34/40 LGA family of 5G modules featuring the Snapdragon X72 chipset, offering high processing power and flexible interfaces for cutting-edge IoT and enterprise sol ...
February 22, 2024
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Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset
Posted by IoT.Business.News
|Date: February 22, 2024
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Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset
Sony Semiconductor Israel announces the commercial launch of the ALT1350 LPWA chipset, featuring low powe ...
Sony Semiconductor Israel announces the commercial launch of the ALT1350 LPWA chipset, featuring low power use, advanced location capabilities, and broad industry support for smart meters and asset tr ...
February 22, 2024
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Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity
Posted by IoT.Business.News
|Date: February 21, 2024
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Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity
Blues partners with Skylo Technologies to introduce Starnote, an affordable satellite connectivity extens ...
Blues partners with Skylo Technologies to introduce Starnote, an affordable satellite connectivity extension for IoT devices providing automatic fallback with no monthly fees, enhancing remote monitor ...
February 21, 2024
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World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2
Posted by IoT.Business.News
|Date: February 21, 2024
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World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2
The rSIM® introduces dual SIM functionality with automatic network switching, enhancing IoT device connec ...
The rSIM® introduces dual SIM functionality with automatic network switching, enhancing IoT device connectivity resilience. Launched with Deutsche Telekom IoT and Tele2 IoT, it aims to reduce outages ...
February 21, 2024
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IoT Platforms: Key Capabilities, Vendor Landscape and Selection Criteria

AIoT: From Connected Data to Intelligent Automation Across Industries

Digital Twins in IoT: From Real-Time Data to Simulation and Optimization

Edge Computing for IoT: Architecture, Use Cases, Benefits and Deployment Strategies

IoT Security: Threats, Best Practices and Secure-by-Design Strategies

Category: IoT Solutions & Innovations

Quectel introduces new ultra-low latency Wi-Fi 7 modules for PC OEMs

Quectel introduces new ultra-low latency Wi-Fi 7 modules for PC OEMs

TCL launches the first 5G RedCap Dongle with Snapdragon® X35 5G Modem-RF System at MWC 2024

TCL launches the first 5G RedCap Dongle with Snapdragon® X35 5G Modem-RF System at MWC 2024

Fibocom Announces the Compatibility of Three Mainstream Operating Systems of its High-end 5G Smart Module SC171 at MWC Barcelona 2024

Fibocom Announces the Compatibility of Three Mainstream Operating Systems of its High-end 5G Smart Module SC171 at MWC Barcelona 2024

Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules at MWC2024

Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules at MWC2024

Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap

Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap

Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations

Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations

Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024

Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024

Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset

Sony Semiconductor Israel Announces Commercial Availability of the ALT1350 LPWA Chipset

Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity

Blues Partners with Skylo Technologies to Unveil Revolutionary Satellite Data Connectivity

World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2

World’s first resilient SIM, rSIM® launches in partnership with global connectivity giants Deutsche Telekom and Tele2